AXUS
Axus Technology provides advanced CMP tools and technology, along with exceptional technical expertise for polishing, wafer cleaning, precision wafer grind processing, and legacy tools; making Axus Technology one of the best highly specialized technology suppliers and consulting services focused on engineering capability and efficiency in supporting the CMP market.

CMP, Wet Processing
Aquarius™ A200-sa Wafer Cleaner
Post-CMP scrubber with the possibility of simultaneous scrubbing of two wafer sizes (up to 200 mm),...
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CMP
Gemini-3 Dual Slurry / Cleaning Chemistry Delivery...
Dual slurry/cleaning chemistry delivery system.
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Grinding/Dicing
AXUS Grinding Foundry Service
Advanced Grinding process development up to standard production foundry.
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CMP
AXUS CMP Foundry Service
Advanced CMP process development up to standard production foundry.
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Grinding/Dicing
DISCO DFG8540 Grinder
Automatic Cassette to cassette high Throughput two-spindle, three-chuck table 200 mm Grinder.
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Grinding/Dicing
DISCO DFG 840/841 Grinder
Cassette to cassette two-spindle, three-chuck table Grinder, enables ultra-thin grinding.
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Grinding/Dicing
Strasbaugh 7AF Grinder
Automatic Cassette to cassette high Throughput two-spindle, 2 Grinding Chucks 200 mm Grinder.
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Grinding/Dicing
Strasbaugh 7AA Grinder
Manual loading automated in-feed Grinder with 2 spindles for up to 150 mm wafers.
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Grinding/Dicing
Disco DAG810 Grinder
Manual Loading Automatic grinder with high-rigidity, low-vibration spindle for superior grinding and low throughput.
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CMP, Wet Processing
OnTrak DSS-200 Synergy™ Post CMP Scrubber
Double-sided PVA scrubber for 100 mm to 200 mm wafers.
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CMP, Wet Processing
OnTrak DSS200 Series 2 Post CMP Scrubber
Double-sided PVA scrubber for 100 mm to 200 mm wafers.
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CMP, Wet Processing
OnTrak DSS-200 Series 1 Post CMP Scrubber
Double-sided PVA scrubber for 100 mm to 200 mm wafers.
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CMP Remanufactured
Strasbaugh 6EC CMP
Manual loading, one-spindle one carrier automated compact dry-in, wet-out (DIWO) CMP System.
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CMP Remanufactured
Surface Automated CMP System
Dry-in, wet-out (DIWO) automated 2-platen one-spindle CMP System.
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CMP
Crystal Carrier upgrade
Carrier upgrade with Axus advanced 4-zone membrane carrier for ultra-thin or fragile wafers.
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