Capstone® CS200

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By AXUS

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Product Type:

Equipment

Application:

CMP

Product Description:

Introducing the groundbreaking Capstone® CS200 series, the latest advancement in CMP processing technology by Axus Technology. Engineered to deliver unparalleled wafer polishing performance for 100, 150, and 200mm wafer sizes, this state-of-the-art system redefines efficiency and precision. With its innovative load-polish-unload sequence, the Capstone® ensures high throughput process capability while minimizing its footprint. Experience up to a 40-50% reduction in slurry consumption, thanks to its optimized application and utilization of chemical mechanical polishing slurry. Additionally, its unique pad conditioning system extends pad life, doubling the longevity compared to other CMP tools. The Capstone® CS200 series isn’t just wafer processing equipment; it’s a transformative solution that significantly reduces CoO, thereby slashing overall CMP process costs.

Experience the future of wafer processing with Capstone®.

Looking to process SiC? Our cutting-edge Capstone® CMP system, paired with the Crystal carrier, offers unparalleled capabilities for handling fragile wafers and achieving advanced profile control. You receive premium-quality silicon carbide substrates with sub-micron TTV and sub-Angstrom surface finish.

Capstone® CS200-sa

The Standalone Configuration with:

  • smalles footprint
  • flexible architecture
  • dual wafer size processing with no hardware or software modification

Click for more details about standard features and optional features of the Capstone® CS200-sa (Standalone Configuration)

 

Capstone® CS200-ia

The Integrated Aquarius Cleaner Configuration:

  • Advanced CMP System with fully integrated Double Sided Post-CMP cleaner for dry-in, dry-out applications
  • True Bridge tool, that can run two different wafer sizes simultaneously

Click for more details about standard features and optional features of the Capstone® CS200-ia (Integrated Aquarius Cleaner Configuration)

 

Capstone® CS200-ma

The Multi-Load/Unload Aquarius Cleaner Configuration:

  • Can be functioned as standalone CMP polishing system or fully automated Dry in-Dry out system with the integrated Double Sided Post-CMP cleaner
  • True Bridge tool, that can run two different wafer sizes simultaneously

Click for more details about standard features and optional features of the Capstone® CS200-ma (Integrated Aquarius Cleaner Configuration)

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