By AXUS
Supplier Info
Product Type:
Equipment
Application:
Grinding/Dicing
Product Description:
The Axus Technology foundry and development processes include CMP and polishing, as well as cleaning, wafer bonding, substrate thinning and edge-grinding processes. With decades of process experience and a fully equipped class 100 cleanroom, the Axus team can process small or large lots of material, develop and combine custom thinning and planarization processes, and provide rapid and economical results. For 300mm users, Axus represents the Fraunhofer Institute to support 300mm process development
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