Product Type:
Equipment
Application:
Wet Process
Product Description:
AXUS technology is specializing in remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spareparts. The Synergy™ scrubber combines the successful principles of wafer cleaning established by OnTrak™ for optimized mechanical slurry particle removal plus metal contamination removal on post-CMP wafers and substrates using chemistries such as HF (optional). The product flow through these tools is linear and the wafers are kept wet throughout until the final drying process.
- Synergy from Bob
- Wet-station wafer loading; wafers in the queue are kept wet by a DI H2O spray. A submergible bath is optional.
- Brush box #1 where the first mechanical-chemical cleaning step occurs using double sided PVA brushes and DI H2O along with dilute cleaning chemistries such as ammonia.
- Brush box #2 which is identical to brush box #1 and where additional cleaning occurs (HF capable through the brushes).
- The SRD (Spin-Rinse-Dry) module is where the wafer is spun at 2000 rpm while it receives a final rinse. Drying occurs with the help of a nitrogen blow off and an infrared lamp. In addition, there is an optional Megasonics
cleaning arm, and dilute chemistries can be dispensed before the spin action begins. - A Mechanical Transfer Arm (robotic arm) transfers the clean and dry wafers to the output station.
- The Output Station has a unique indexer that reliably receives the clean dry wafer from the mechanical arm and places it down into the receive cassette where it is held in a vertical position until the run is completed.
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The Synergy™ is a post-CMP Double Sided Scrubber is designed to provide a platform for cleaning recipes that can incorporate a variety of chemical process combinations. The Synergy™ can also be used in applications such as MEMS and LEDs and is not limited only to Post-CMP cleaning. Through-the-brush chemical distribution, and bevel edge cleaning is included.