The Disco DFG8540 System is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter and thin-finish grinding. The DFG8540’s processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.
- Automated thinning up to 200 mm diameter wafers
- Ultra-thin wafer handling to 100 µm and less
- DBG option available and Plasma-ready
- Flat/Notch alignment orientation
- Interior grind water nozzle
- Chuck/Spinner table
- Positioning and stopping system
- 2 spindles, 3 rotary-chuck table
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