
(De-)Taping • Mounting • Curing
EXM-800CS 200mm Wafer Mounter
Wafer Mount & BG Tape Remover system with in-line LED UV irradiator.
INFODiscover Teikoku’s Versatile Taping, Detaping, and Mounting Solutions.
Teikoku’s innovative tools are designed to handle a wide range of substrates, including fragile and exotic materials.
Wafer Mount & BG Tape Remover system with in-line LED UV irradiator.
INFOInline UV irradiation and BG de-taping available, suitable for ultra-thin wafers.
INFOSemi-Automatic Tape Remover. Please contact us for more information.
INFOSemi-Automatic Tape Laminator for wafers up to 200 mm. Please contact us for more information.
INFOUV irradiation equipment for dicing tape, suitable for wafers up to 300 mm.
INFOFor 4″, 5″, 6″, and 8″ wafers, suitable for thinner/bumpy wafers.
INFOLaser Cutting with heating roller, table and digitally adjustable high pressure performance.
INFOSingle and double cassette loading, also suitable for ultra-thin wafers.
INFOTwo cutting methods, e.g. patented laser cutting system, suitable for thin wafers.
INFOFully Automatic 200 mm Tape Remover.
INFOTwo cutting methods, e.g. patented laser cutting system, suitable for thin wafers.
INFOManual 6″ to 12″ wafer frame UV curing machine.
INFO6″ to 12″ manual wafer mounter.
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