by AXUS (Italy and UK only)
Capstone CS200-ma (Standalone Configuration) CMP system of Axus Technology, side view

CMP

Capstone® CS200

High-throughput dry-in, dry-out (DIDO) CMP tool for 100–200 mm wafers.

INFO
Back to Top
Back to Top
Back to Top
Back to Top
Back to Top
by AXUS (Italy and UK only)
Image of DFG8540 Grinder from Axus Technology

Grinding/Dicing

DISCO DFG8540 Grinder

Automatic Cassette to cassette high Throughput two-spindle, three-chuck table 200 mm Grinder.

INFO
Back to Top
by AXUS (Italy and UK only)
DISCO DFG 840/841 Grinder

Grinding/Dicing

DISCO DFG 840/841 Grinder

Cassette to cassette two-spindle, three-chuck table Grinder, enables ultra-thin grinding.

INFO
Back to Top
by AXUS (Italy and UK only)
Strasbaugh 7AF Grinder

Grinding/Dicing

Strasbaugh 7AF Grinder

Automatic Cassette to cassette high Throughput two-spindle, 2 Grinding Chucks 200 mm Grinder.

INFO
Back to Top
by AXUS (Italy and UK only)
Strasbaugh 7AA Grinder

Grinding/Dicing

Strasbaugh 7AA Grinder

Manual loading automated in-feed Grinder with 2 spindles for up to 150 mm wafers.

INFO
Back to Top
by AXUS (Italy and UK only)
Disco DAG810

Grinding/Dicing

Disco DAG810 Grinder

Manual Loading Automatic grinder with high-rigidity, low-vibration spindle for superior grinding and low throughput.

INFO
Back to Top
Back to Top
Back to Top
Back to Top
by AXUS (Italy and UK only)
axus-Strasbaugh 6EC Chemical Mechanical Planarization

CMP Remanufactured

Strasbaugh 6EC CMP

Manual loading, one-spindle one carrier automated compact dry-in, wet-out (DIWO) CMP System.

INFO
Back to Top
Back to Top
by AXUS (Italy and UK only)
Crystal Carrier Upgrade of Axus Technology

CMP

Crystal Carrier upgrade

Carrier upgrade with Axus advanced 4-zone membrane carrier for ultra-thin or fragile wafers.

INFO
Back to Top