The Autosamdri®-931, the 5th generation automatic Critical Point Dryer (CPD) from Tousimis’ Autosamdri® range, has recently been installed at one of Germany’s most prestigious research universities. A technical university with a clear mission to advance science and technology for the benefit of society. Progress and success can only be achieved with the highest quality equipment.

Tousimis‘ Managing Director Yianni Tousimis says: “The first automated CPD system in the world was the Autosamdri®-810 released in 1976. We have learned many things since that first-generation system back in the 70s! We are very pleased to be able to bundle these CPD innovations into the latest Autosamdri® 931 family. Such things as recipe capability, previous run data review and Stasis Software to mention a few key items that make it stand alone. Microscopy Today awarded the 931 the most innovative CPD sample preparation piece of equipment during it’s world release.
The Autosamdri®-931 I capable of processing complex samples to dry such as GELS as easily as it does basic SEM sample preparation. We call it our multi-application CPD system as it does exactly that!”. Let us convince you with the video of Autosamdri®-931 at Youtube.

Would you also like to use the latest technology to achieve the best results? Take a closer look at the Autosamdri®-931 and download the flyer of Autosamdri®-931.

Capstone™ CMP processing tool

We are delighted to introduce Capstone™ – the CMP processing tool for ultimate wafer polishing performance for 100, 150, and 200mm wafer sizes from Axus Technology.

It is the first CMP tool that can run two different wafer sizes simultaneously.
The integrated Crystal carrier for fragile wafer handling and advanced profile control delivers premium-quality silicon carbide substrates with sub-micron TTV and sub-Angstrom surface finish. Capstone® enhances the efficiency of chemical mechanical polishing (CMP) slurry application and utilization, resulting in a remarkable 40-50% reduction in slurry consumption. Additionally, its distinctive pad conditioning system extends the pad life by up to twice as much as other CMP tools.
With Axus Capstone™, we achieve material removal rates of over 10 microns per hour on the silicon face, ensuring outstanding product outcomes and higher throughput.

The Capstone® CS200 series is the wafer processing equipment of the future and brings significant reduction in CoO, substantially reducing overall CMP process costs.

Experience the future of SiC CMP technology with Axus Capstone™.

Brows all Axus products

Learn more about Axus

Implementing Flow Meters Significantly Improves Fab Process Quality

Reproducibility and maintaining strict quality control throughout the entire wafer manufacturing process are top priorities in the semiconductor industry. Thus, stable and highly accurate flow measurement is essential for many semiconductor manufacturing steps. Non-contact clamp-on flow meters such as SEMIFLOW CO.65 have proven to fulfill this demanding task reliably.

The ultrasonic sensors measure through the wall of the tube or pipe and substantially reduce the risk of contamination or leakage of hazardous fluids. With the SEMIFLOW flow meter series, the ultrasound specialist SONOTEC has developed metal-free contactless flow meters particularly designed for the requirements in the semiconductor industry – also for hazardous environments. The compact sensors with integrated electronics board are available in multiple sizes suitable for all common rigid plastic tubes and pipes used in fabs.

Flow Monitoring in CMP │ Slurry preparation│ Volume dosing of photoresist

Non-Contact Flow Monitoring in CMP Processes

Reproducibility and maintaining strict quality control throughout the entire wafer manufacturing process are top priorities in the semiconductor industry. Thus, stable and highly accurate flow measurement is essential for many semiconductor manufacturing steps. Non-contact clamp-on flow meters have proven to fulfill this demanding task reliably. The ultrasonic sensors measure through the wall of the tube or pipe and substantially reduce the risk of contamination or leakage of hazardous fluids. With the SEMIFLOW flow meter series, the ultrasound specialist SONOTEC has developed metal-free contactless flow meters particularly designed for the requirements in the semiconductor industry – also for hazardous environments. The compact sensors with integrated electronics board are available in multiple sizes suitable for all common rigid plastic tubes and pipes used in fabs.

In order to guarantee continuous high product quality, a tight liquid flow monitoring is necessary. From liquid storage containers to the application in the process, the liquid flow must be monitored and tracked, e.g., to measure the volume flow in a transfer line or to control the volume output at the points of use. Ultrasonic clamp-on flow meters can be implemented in low- and high-volume manufacturing settings and used reliably regardless of the type or blending of the chemicals in the tube.

Reliable Monitoring of Slurry Consumption in Chemical-Mechanical Planarization

Simplified schematic illustration on a chemical-mechanical planarization (CMP) process with implemented non-contact flow meter

Chemical-mechanical planarization or polishing (CMP) is one of the leading technologies to manufacture state-of-the-art microelectronic components and micro-electro-mechanical systems (MEMS). In order to produce modern integrated circuits with multiple wiring levels and smallest line widths, highly precise flat and smooth surfaces are needed. CMP processes have become also very important in the finishing of wafer-thinning processes and the production of vertical contacts through the silicon wafer.

Since the industry is persistently looking for further ways to reduce the structure width, the requirements in process design are becoming more detailed and stringent. Hence, CMP processes are getting more complex and quality standards grow constantly. As a consequence, process parameters have to be monitored very closely at various steps to avoid deviations in product quality that might lead to costly failures.

In CMP processes, flow meters accurately monitor the dispensing of slurry on the polishing plate. Additionally, they are installed to count the volume flow to calculate the amount of slurry used at this process step. Flow sensors also monitor precisely the consumption of slurry in supply tanks or in the pipe system to determine the transfer volume. Every fab uses its own slurry blending. Non-contact flow meters are well-suited for contamination-free flow or volume measurement of liquids, work independently of the slurry composition and are free of wear and tear.

Fundamentals on Chemical-Mechanical Polishing / Planarization (CMP)

CMP is a key technology in any semiconductor fabrication. It is applied in both, substrate as well as device fabrication. Advanced semiconductor devices easily need more than 30 CMP processes to get to its final stage.

CMP aims on perfect smooth surfaces with almost no remaining topography. To that, the wafer surface is polished using a slurry and a polish pad. Slurry describes a chemical fluid that contains abrasive nanoparticles dispersed in acidic or basic solution. During the CMP process step the wafer is pressed on the rotating polish pad, while slurry is continuously dispensed. Specifically, the slurry chemically modifies the uppermost surface layer, which is then mechanically cracked and removed by slurry abrasives.

Efficient Slurry Blending and Dispensing at Each Point of Use

Automatic slurry dispense platforms guarantee an efficient slurry distribution during continuous operations in CMP manufacturing environments. In order to have a redundant system monitoring, non-contact flow meters are installed in addition to each distribution pump to make sure that the defined product quality remains constantly at the same high level. Contactless ultrasound flow measurement guarantees that the slurry or chemical in the pipe or tube is not contaminated or influenced by the measurement device. Additionally, the flow sensor can conveniently be replaced or moved to another position without having to intervene in the closed pipe system.

Simplified schematic illustration on slurry management and slurry distribution with implemented non-contact flow meter

Slurry Management and Distribution

By monitoring the slurry composition and concentration with automatic dosing and blend correction throughout the entire pipe system, precise metrology options are used. Via additional tank or mixing stations in the fab, blend corrections can be processed. For this step, highly accurate and reliable flow meters control the related pumps. Thus, the exact slurry blending can be ensured and efficiently used. Additionally, flow meters guarantee both system and component redundancy throughout the entire wafer manufacturing process.

In large manufacturing facilities, transfer pumps control the slurry supply via fab-wide loop pipe systems. For redundancy reasons, implemented clamp-on flow sensors monitor the liquid flow or volume in the pipe system.

 

---

 

Precise Distribution of Photoresist in Lithography Applications

In semiconductor manufacturing, the process of photolithography describes the processing of circuit board designs on silicon wafers by means of light. The process starts with coating the wafer with a chemical layer called photoresist. The layer of the photoresist must be extremely precise. For the exact volume dosing of these photoresist layers, highly accurate flow meters are implemented to redundantly monitor the pump behavior. By implementing non-contact ultrasonic SONOCHECK air bubble detectors, even smallest air bubbles can be detected that might occur in the coating process.

In a further step, light passes through a photomask and creates an optical image of the circuit layout on the wafer. The generated light reacts with the photoresist which is washed away in the next process step. Thus, the underlying oxide layer is exposed. By using certain acid baths, further oxide and residues of the underlying silicon layer are removed. As the acid baths have to be kept with an even filling level, non-contact flow meters precisely monitor the filling of the wet benches. Thanks to the non-contact measurement method it is not necessary to replace the sensor after cleaning procedures or servicing. The described process is repeated several times with different combinations of chemicals and masks, building up the layout structure of the later processor.

Finally, the doping process is applied to the exposed silicon, changing its electrical properties. Current photolithography processes often include around 30 or more separate masks to layer circuit patterns on top of each other.

 

Image © SONOTEC GmbH

Rhosonics ultrasonic technology for measuring any chemical or solid in production processes.

We are proud, to announce the news of our collaboration with Rhosonics. A company, based in the Netherlands, in Putten, that has been developing sustainable ultrasonic measuring instruments for process optimization for over 30 years.

Rhosonics design, produce, and supply state-of-the-art ultrasonic sensors and analyzers for various industries, such as the semiconductor industry.

For the semiconductor industry they offer Chemical Concentration Meters. Rhosonics’ ultrasonic technology provides better oversight of the process by simultaneously monitoring multiple chemical concentrations in real-time. The real-time process data allows operators to achieve process optimization in a safe, reliable, sustainable, and cost- effective way. This is a great gain for our customers.

Browse all Rhosonics products

Learn more about Rhosonics

In the picture you see Thomas Riedel (left, S3 Alliance) with Frank Termeulen and Samir Rustamov (Rhosonics).

NDS most popular product is the Heat-Resistant Dicing Tape.

It is an UV curable type, and even if it is heated up 150 °C in your process for 1 hour, it can easily be peeled from the work after UV irradiation, and there is little generating of an adhesive residue.
The Heat-Resistant Tape “HUV-7000 Series” is available in different types and is suitable for all processes in a clean room.

Check out NDS most popular Heat-Resistand Dicing Tape

Click here for all our NDS products

NDS | S3 Alliance (s3-alliance.com)

Otto von Guericke University Magdeburg received a Table top SEM CUBE II from EMCrafts

S3 Alliance has sold and installed an EMCrafts CUBE II scanning electron microscope (SEM) at the Otto-von-Guericke-University  Magdeburg. Weighing only 65 kg, the CUBE II is a very compact tabletop SEM that can be used by the co-workers and students of Prof F. Scheffler’s Industrial Chemistry group, whenever they need a SEM. It is a highly advanced instrument with 5 axes of motion and a resolution of up to 5.0 nm. With optional detectors like EDS (compatible with Oxford, Bruker, EDAX, Thermo), even the chemical composition of various kinds of samples can be explored.
Included are: Auto Rotation, Auto Tilt, Chamber Camera and Navigation. Like this, staff and students can analyze their samples using CUBE II’s simple and intuitive user interface.

The fast imaging capabilities of the Cube II SEM allow for rapid collection of large amounts of data, which is particularly useful for studies requiring large numbers of samples. Dr A. Lieb from the Otto-von-Guericke-University Magdeburg is extraordinarily satisfied with the technical know-how and the commitment of S3 Alliance service technicians on site.

In summary, the Cube II SEM from EMcrafts is a powerful and versatile tool for exploring the micro and nano world. With its high resolution, fast imaging, chemical analysis capabilities, and ease of operation, it is a valuable device for professionals in many fields. It is absolutely forward-looking and exactly the right way for university teaching and research at very affordable costs.

Click for technical details

Electroplating Tool EPM 2 for Si, GaAs, SiC, Glass and more

Development of new technologies often requires a fast time to market. Therefore process set-up times and flexibility matter as much as perfect quality and meeting customer requirements. With the development of the EPM 2, the RENA manual wet bench for plating applications like UBM, Bumping, Cu pillars, TSVs, RDL, Micro Forming and more we are taking care of your needs.

Features:

• Outstanding process control and process stability
• New fountain with multi-zone anodes provides outstanding plating results and a massive uniformity improvement down to 3 %
• Reduced consumption of additives by up to 20 %
• Small footprint
• High process flexibility
• Easy maintenance
• SECS/GEM integration

Wafersize: 2“ – 8“
Substrate Materials: Si, SiC, SiGe, Glass, Sapphire, Ceramic, GaN, GaAs etc.
Plating Materials: Cu, Au, Ni, In, SnAg, Sn, Pt, PbSn, FeNi etc.

 See all available Versions:

For more information visit our product page

or view all RENA semiconductor MEMS equipment 

Installation of an e3511 Wafer Ashing System at EPFL, Swiss Federal Institute of Technology

Last year, S3 Alliance installed an e3511 Wafer Ashing System from ESI at EPFL, Swiss Federal Institute of Technology. One of Europe’s most vibrant and cosmopolitan science and technology institutions.

The tool was installed inside the Center of MicroNanoTechnology (CMi), a complex of cleanrooms and processing equipment for the training and scientific experimentation devoted to the users of microtechnology.

Mr. Pernollet, process engineer at CMi, stated:
“S3 Alliance installed this tool as complementary to our regular barrel type ashers. Hardware of the e3511 offers us higher rate of resist removal and improved uniformity across wafers which is a real plus for descum processes. The quick and easy handling allows for fast training of our users and the tool proves to be versatile and robust which is a must-have characteristic for our users-based platform!”

See the technical information about e3511

or brows all our products of ESI

ESI, with a focus on serving the semiconductor industry and Gasonic Asher Equipment