Electroplating Tool EPM 2 for Si, GaAs, SiC, Glass and more
Development of new technologies often requires a fast time to market. Therefore process set-up times and flexibility matter as much as perfect quality and meeting customer requirements. With the development of the EPM 2, the RENA manual wet bench for plating applications like UBM, Bumping, Cu pillars, TSVs, RDL, Micro Forming and more we are taking care of your needs.
- Outstanding process control and process stability
- New fountain with multi-zone anodes provides outstanding plating results and a massive uniformity improvement down to 3 %
- Reduced consumption of additives by up to 20 %
- Small footprint
- High process flexibility
- Easy maintenance
- SECS/GEM integration
Wafersize: 2“ – 8“
Substrate Materials: Si, SiC, SiGe, Glass, Sapphire, Ceramic, GaN, GaAs etc.
Plating Materials: Cu, Au, Ni, In, SnAg, Sn, Pt, PbSn, FeNi etc.