Product Type:
Equipment
Application:
Taping Detaping Mounting Curing
Product Description:
Wafer MOUNT & BG Tape REMOVER Multi-Function system with In-line LED UV irradiator TECHNICAL SPECIFICATION
Features
- Wafer Size : Up to 8 inch (To be specify wafer type prior to issue the PO)
- Load Capacity : One (1 ) TTS Original Cassette Station
- Unload Capacity : One (1) Unload Magazine Station
- Cassette : SEMI Standard Open Cassette (Use Even slot only if use Bernoulli finger): or DSC
- Frame Magazine : SEMI 25 Slots SEMI Standard 6” Frame Cassette: or SEMI 25 Slots SEMI Standard 8” Frame Cassette
- Dicing Frame Type : DISCO Standard DF2-8 or Equivalent Frame Vender (To be specify wafer type prior to issue the PO)
- UPH : 15 – 20 WPH (UPH depends on recipe setting)
- Mounting Tape : Normal Roll shape tape (UV & non-UV tapes) or Pre-Cut Type tape(Option)
- Remove Tape : Heat Seal tape Removal Function for BG Tape removal
- CCD none contact alignment : CCD sensor and Bernoulli Finger type alignment for thin wafer
- Long-life Roller Blade : Newly designed Roller Cutting Blade lasts up to 100,000 times. (Applicable for normal roll tape)
- Heater Capability : Max 60 degree C±3 degree C @ Mount Heat Roller: Max 60 degree C±3 degree C @ Wafer stage with Soft Si Table: Room Temp (Roller Cutter)
- Big LCD Touch Screen : Big color screen for user friendly and easy operations.
- System Recipe capacity : 100 (Max)
- Advanced Maintenance Design : Minimum-lubrication, Easy maintenance designs.
Wafer Mount & BG Tape Remove Function
- Removing Module for BG Tape : Heat Seal tape Removal Function for BG Tape removal : Maximum applicable tape width: 75 mm
- Soft Si Rubber Mount Table : Applicable Soft Silicone rubber Universal Table (With Full ESD controlled contacts are) Soft Silicone rubber table achieves highly secured wafer holding during Dicing Tape Lamination
- Remove Table : Applicable Ceramic Universal Table for BG Tape Remove
Ceramic Remove Table
Soft SI Mount Table
- Frame Stock Station : Frame Stock station equipped with frame Stock Detection and double frames detection
- Applicable Mounting Tape Width : 8” Frame > 295mm (min) 330mm (max)
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Optional Function
- Thin Wafer Capability : Micro Bernoulli Finger can be handle Thin wafer
- Wafer Mapping Capability : Applicable Intellige nt Wafer Mapping at Loading Station
- In Line LED UV Irradiat or : Intelligent LED UV irradiation meth ods UV Lamp Life Guaranteed 1 5,000 hours)
- SECS/GEM :Applicable TTS Standard SECS/GEM capability following SEMI Stand
- Frame Barco de Print & Reader : Applicable Integrated Frame barcode read er by Keyence, Printer by SATO.
- Wafer ID OCR : High performance OCR Vision Engine by (Option must place PO together with equipment)
System Dimensions & Utilities
- Dimensions : 1900mm (W) x 2500mm (D) x 1900mm (H)
- Weight : ≈ 1800kg
- Required Power : 200 – 240V, 3KVA Single Phase
- Compressed Air : 0.6 MPa (70PSI) Minimum 120 NL / min
- Vacuum Source : Minimum 600mmHg 60 NL / min
file_downloadTTS-Fully-Automated-Wafer-Mountor-with-3-in-1-Function_EXM-800CS-LUVR-CE-V1_For-TDK-Micronas_200921.pdf
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