EXR1200 Frame UV Irradiator

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By TEIKOKU

Supplier Info

Product Type:

Equipment


Application:

(De-)Taping • Mounting • Curing


Product Description:

Features

  • UV irradiation equipment for dicing tape. For wafers up to 300 mm.
  • All parameters important for UV irradiation can be controlled in the recipe.
  • Settings can be quickly changed to process different wafer/frame sizes.
  • Longer-lasting UV lamp realized by TTS’s proprietary UV technology.
  • Other optional features are available.


Power AC200-240 V
Single Phase Power Consumption 3 KVA [with UV]
Clean Air Pressure (CDA) 0.5 – 0.6 MPa (Min Flow Rate: 120 NL/min)
Vacuum 650 – 750 mmHg (Min Flow Rate: 60 NL/min)
Nitrogen (For UV) 0.2 – 0.4 MPa (Min Flow Rate: 20NL/min)
Exhaust Duct Capacity 1.0 m3/min, 10 mm H20 (100 mm diameter SUS Flange duct connection)

System Arrangement

Dimension(WxDxH mm) 1350×1250×1800
Net Weight Appx 500 kg

The semi-automatic model is also available. Please contact us for details.

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Currently, no information for the application is available.


Product Enquiry Form

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