Fully Automatic Wafer Tape Mounter

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By TEIKOKU

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Product Type:

Equipment


Application:

Taping Detaping Mounting Curing


EXM-1200X> 300mm Fully-automatic Wafer Tape Mounter

  • A wafer tape mounter for wafers of 300mm. (optionally available: 8inches)
  • All parameters important for attaching a wafer onto a frame can be controlled in the recipe.
  • Can be used with ultra-thin wafers. (such as shaped or reworked wafers)
  • h-iline UV irradiation and BG de-taping features available. (options)
  • Longer-lasting UV lamp realized by US’s proprietary UV technology
  • Other optional features are available.
  • Power AC200 – 240V
  • Single Phase Power Consumption
  • 2KVA[Without UV] 3KVA[With UV]
  • Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min )
  • Vacuum 650 – 750mmHg( Min Flow Rate:60NL/min )
  • Nitrogen(For UV) 0.2-0.4 Mpa ( Min Flow Rate:20NL/min )
  • Exhaust Duct Capacity 1.0m3/min
  • lOmmH20 (100mm diameter SUS Flange duct connection)
  • System Arrangement Dimension (WxDxHmm) 1900 x 2500 x 1900
  • Net Weight Appx 1800Kg

ATM-800X> 200mm Fully-automatic Wafer Mounter

  • A wafer mounter for wafers up to 200mm (8inches). (4-, 5-, 6-, and 8-inch)
  • All parameters important for attachment can be controlled in the recipe.
  • Can be used with thinner/bumpy wafers.
  • Other optional features are available.
  • Power AC200 – 240V, Single Phase
  • Power Consumption 2KVA
  • Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min )
  • Vacuum 650 – 750mmHg( Min Flow Rate:60NL/min )
  • System Arrangement Dimension(WxDxHmm) 1830 x 1050 x 1800
  • Net Weight Appx 1000Kg

The semi-automatic model is also available. (Please contact us for details.)

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