Product Type:
Equipment
Application:
(De-)Taping • Mounting • Curing
Product Description:
Laser Cutting with heating roller and table and Digitally adjustable high-pressure performance.
- Removes tape from wafers of 300 mm (12″) (optionally available: 8″)
- Single and double cassette loading
- Parameters for de-taping can be controlled in the recipe
- Longer-lasting UV lamp realized by TTS’s proprietary UV technology
- Also suitable for ultra-thin wafers
- Removing type: Sticky or Heat Seal
- Several features are available
Machine Utilities
| Power: | AC200-240 V, Single Phase |
| Power Consumption: | 2 KVA (without UV) / 3 KVA (with UV) |
| Clean Air Pressure (CDA): | 0.5 – 0.6 MPa (Min Flow Rate: 120NL/min) |
| Vacuum | 650 – 750 mm Hg (Min Flow Rate: 60 NL/min) |
| Nitrogen (for UV) | 0.2 – 0.4 MPa (Min Flow Rate: 20 NL/min) |
| Exhaust Duct Capacity | 1.0 m3/min, 10 mm H20 (100 mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension (WxDxH) | 1350×1750×2000 mm |
| Net Weight | Appx 1000 kg |
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Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.