EXR2 Fully Automatic 300mm Tape Remover

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By TEIKOKU

Supplier Info


You may be interested in these products:

DXR2 Fully Automatic 200mm Tape Remover

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SXR800X Semi-Automatic Tape Remover

Semi-Automatic Tape Remover.   Please contact us for more information.

Product Type:

Equipment


Application:

(De-)Taping • Mounting • Curing


Product Description:

Laser Cutting with heating roller and table and Digitally adjustable high-pressure performance.

  • Removes tape from wafers of 300 mm (12″) (optionally available: 8″)
  • Single and double cassette loading
  • Parameters for de-taping can be controlled in the recipe
  • Longer-lasting UV lamp realized by TTS’s proprietary UV technology
  • Also suitable for ultra-thin wafers
  • Removing type: Sticky or Heat Seal
  • Several features are available


Machine Utilities

Power: AC200-240 V, Single Phase
Power Consumption: 2 KVA (without UV) / 3 KVA (with UV)
Clean Air Pressure (CDA): 0.5 – 0.6 MPa (Min Flow Rate: 120NL/min)
Vacuum 650 – 750 mm Hg (Min Flow Rate: 60 NL/min)
Nitrogen (for UV) 0.2 – 0.4 MPa (Min Flow Rate: 20 NL/min)
Exhaust Duct Capacity 1.0 m3/min, 10 mm H20 (100 mm diameter SUS Flange duct connection)

 

System Arrangement

Dimension (WxDxH) 1350×1750×2000 mm
Net Weight Appx 1000 kg

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Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.

 



You might be interested in:

DXR2 Fully Automatic 200mm Tape Remover

Laser Cutting with heating roller and table and digitally adjustable high-pressure performance. Removes tape from wafers…

SXR800X Semi-Automatic Tape Remover

Semi-Automatic Tape Remover.   Please contact us for more information.


Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.