Product Type:
Equipment
Application:
(De-)Taping • Mounting • Curing
Product Description:
- Tape lamination for 300 mm wafers (optionally available: 8″).
- Single and double cassette loading.
- Two cutting methods (V-notch cutting): digital cutter blade method and class 4 CO2 laser method.
Laser Cutting with heating roller and table and Digitally adjustable high-pressure performance. - Parameters for taping can be controlled in the recipe.
- Also suitable for thinner wafers (such as shaped or reworked wafers).
- Several features are available.
Machine Utilities
| Power: | AC200-240 V, Single Phase |
| Power Consumption: | 3 KVA |
| Clean Air Pressure (CDA): | 0.5 – 0.6 MPa (Min Flow Rate: 120 NL/min) |
| Vacuum | 650 – 750 mm Hg (Min Flow Rate: 60 NL/min) |
| Exhaust Duct Capacity | 5.0 m 3/min, 40 mm H20 (100 mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension (WxDxH) | 1350×1750×2200 mm |
| Net Weight | Appx 1000 kg |
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Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.