EXL2 Fully Automatic 300mm Wafer Tape Laminator

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By TEIKOKU

Supplier Info

Product Type:

Equipment


Application:

Taping Detaping Mounting Curing


Product Description:

EXL2 Fully Automatic 300mm Wafer Tape Laminator


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  • Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.

 

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Product Enquiry Form

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