(De-)Taping • Mounting • Curing
EXM-800CS 200mm Wafer Mounter
Wafer Mount & BG Tape Remover system with in-line LED UV irradiator.
INFODiscover Versatile Taping, Detaping, and Mounting Solutions.
These innovative tools are designed to handle a wide range of substrates, including fragile and exotic materials.
Wafer Mount & BG Tape Remover system with in-line LED UV irradiator.
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Inline UV irradiation and BG de-taping available, suitable for ultra-thin wafers.
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Semi-Automatic Tape Remover. Please contact us for more information.
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Semi-Automatic Tape Laminator for wafers up to 200 mm. Please contact us for more information.
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UV irradiation equipment for dicing tape, suitable for wafers up to 300 mm.
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For 4″, 5″, 6″, and 8″ wafers, suitable for thinner/bumpy wafers.
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Laser Cutting with heating roller, table and digitally adjustable high pressure performance.
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Single and double cassette loading, also suitable for ultra-thin wafers.
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Two cutting methods, e.g. patented laser cutting system, suitable for thin wafers.
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Fully Automatic 200 mm Tape Remover.
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Two cutting methods, e.g. patented laser cutting system, suitable for thin wafers.
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Manual 6″ to 12″ wafer frame UV curing machine.
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6″ to 12″ manual wafer mounter.
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