
Grinding/Dicing
HiSpec XP Injector
Designed for automated premixing and delivery of dicing fluid in mid to high volume wafer dicing...
INFOS3 Alliance offers Axus refurbished grinders and NDS new dicing tools, providing a comprehensive solution for your wafer processing needs. Our partnership with Axus and NDS ensures that you receive high-quality equipment that meets the highest industry standards.
Designed for automated premixing and delivery of dicing fluid in mid to high volume wafer dicing...
INFOFor direct dosing of dicing fluid into the DI water line for wafer dicing operations.
INFOA compact, saw-side injector system designed for precise dosing of dicing fluid in wafer dicing applications.
INFOAdvanced Grinding process development up to standard production foundry.
INFOManual Loading Automatic grinder with high-rigidity, low-vibration spindle for superior grinding and low throughput.
INFOCassette to cassette two-spindle, three-chuck table Grinder, enables ultra-thin grinding.
INFOAutomatic Cassette to cassette high Throughput two-spindle, three-chuck table 200 mm Grinder.
INFOManual loading automated in-feed Grinder with 2 spindles for up to 150 mm wafers.
INFOAutomatic Cassette to cassette high Throughput two-spindle, 2 Grinding Chucks 200 mm Grinder.
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