DISCO DFG8540 Grinder

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By AXUS

Supplier Info


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Product Type:

Equipment


Application:

Grinding/Dicing


Product Description:

Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design, the DFG8540 is capable of performing both large diameter grinding and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance.


Features:
  •     Automated thinning up to 200 mm diameter wafers
  •     Ultra-thin wafer handling to 100 µm and less
  •     DBG option available and plasma-ready
  •     Flat/Notch alignment orientation
  •     Interior grind water nozzle
  •     Chuck/Spinner table
  •     Positioning and stopping system
  •     2 air bearing grind spindles, 3 rotary-chuck tables

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You might be interested in:

Disco DAG810 Grinder

AXUS technology specializes in the remanufacturing of CMP, Wafer Grinding & Wafer Cleaning  Equipments as well…


Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.