By GNP
Supplier Info
Product Type:
Equipment
Application:
CMP
Product Description:
The GnP POLI-400L is designed for Advanced CMP Process Development Applications such as MEMS, as well as CMP Characteristics Study. This System has a Low Cost of Ownership and a Small Footprint.
- Head, Table 30–200 RPM, Rotational motion, Head oscillation(± 12 ㎜)
- Size: 700 (W) x 800 (D) x 1,200 (H) ㎜ (POLI – 400) and 970 (W) x 1,010 (D) x 1,850 (H) ㎜ (POLI- 400L)
- Platen size Ø406 ㎜ (16″), Anodized Aluminum (Option: Teflon Coated)
- Pressing method: Variable air pressure electronic controller
- Carrier Type: 70–500 g/㎠ (1–7.1 psi) for 4″ wafer
- Membrane Type: 70–500 g/㎠ (1–7.1 psi) for 4″, 6″ wafer
- Process Automatic sequence, Dry-in / Wet-out
Features
- Workpiece: Max 6″ wafer, MEMS Structure, Coupon Wafer
- CMP Process: Si CMP, Oxide CMP (BPSG, TEOS, SC), Metal CMP (W, Cu), STI, PGI, and more.
Options
- Conditioning: Oscillating Head Type or Swing Arm Type
- Double Head System
- Friction Force & Temperature Monitoring System
- Characteristics
- Stable Repeatability (WTWNU <5%)
- High Rigidity
- Simple, Robust, and Low Cost of Ownership
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- Workpiece: Max 6″ wafer, MEMS structure, Coupon wafer
- CMP Process Si CMP, Oxide CMP(BPSG, TEOS, ThOx), Metal CMP(W, Cu), STI, etc.