Product Type:
Equipment
Application:
Wet Processing
Product Description:
MEI’s Revolution is an automated, multi-step, Rotary wet bench system. With IDX Flexware Control, an integrated rotary robot, and a custom process tank configuration MEI creates powerful, flexible solutions and equipment that require minimal footprint. SECS/GEM compliant IDX Flexware Process Control software provides outstanding control and flexibility, custom-tailored to your process solution. Our new, robust rotary robots can handle carriers up to 300 mm wafers through multiple process steps and recipe configurations. Configurability, up-time, yield, maintainability, and throughput are the hallmarks of an MEI wet processing system.
Features for Optimum Performance
- 2–5 tanks
- Megasonic or ultrasonic bath
- Heater (including solid-state), chiller, and dryer options
- Chemical spiking, in-tank blending, filtration concentration monitoring, bulk fill, agitation, DI flush, and drain options
- PVDF, stainless, quartz, Halar, or natural poly
- Optional tank lids
- Pressure or optical tank level monitoring
- QDR tank with sparger bar spraying method, shared facilities,
- Robust dump cylinder
System Options
- Custom Designed for Your Process
- 100–300 mm wafer Sizes
- Input/output queues or manual loading
- Acid/base or solvent
- Choice of FM4910 (Halar, CPVC, PVDF), polypropylene, or stainless steel
- Chemical spiking, recirculation, and filtration
- Manual pour chemistry via deck-mounted cup or chemical spiking reservoir
- End effector materials PVDF/ PTFE, Halar, quartz, or stainless steel
- Fire suppression (available upon request)
Integrated Dryer Options
- Technology node 200 nm
- Best particle performance on hydrophilic surfaces
- Compatible with processing
- Teflon cassettes
- Slow-drain Marangoni process
- Static wafer lifter to minimize water contact marks
- Dry cycle time 15–20 min
- 10–20 ml IPA per cycle
- Etch, Strip, Cleaning, and MLO Wet Bench with Minimal Fab Footprint FEOL Resist Strip
- RCA Clean
- BEOL Resist Strip
- InGaP-GaAs Etch
- Post CMP Clean
- Prediffusion Clean
- Oxide Etch
- SWP Clean
- Developer
- Nitride Etch