Post CMP Scrubber 812L

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By GNP

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (4″~12″) Wafers.


Applicable wafer size : 200㎜(8”) and 300㎜(12”)
Configuration:

  • Stand alone with 4 cleaning station
  • Pre-cleaning with DIW knife
  • Two double side roll brush cleaning
  • Spin rinse dry with N2 blow (Option : Separated QDR)
  • Cleaner size : 1,970W 975D 1,380H㎜
  • Brush size : Ø70(OD) Ø32(ID) 320(L)㎜

Pre cleaning station:

  • DIW spray cleaning & DIW curtain between stations
  • Roller brush station
  • Chemical : NH4OH(<1%) or DIW
  • Brush type : Double side PVA brush
  • Rotating speed : <±2% of full scale Range 30 ~ 300rpm
  • Chemical supply : 4 Nozzle and through the brush
  • Available chemical : 2 Chemical[NH4OH]
  • Chemical flow rate : < 1L/min full scale
  • DI flow rate : < 5L/min full scale

Spin station

  • Spin speed : Max 2,500rpm
  • DIW rinse / N2 Blow(Option :Megasonic sweep)

Control

  • Process : Auto wafer loading with Automatic sequence, Wet-in/Dry-out
  • Sequence control : PC & PC touch monitor, Programmable sequence, Computer Network Comparable

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Cleaning of semiconductor wafers  200㎜(8”) and 300㎜(12”)


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