By AXUS
Supplier Info
Product Type:
Equipment
Application:
Grinding/Dicing
Product Description:
AXUS technology specializes in the remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spare parts.
Refurbished DFG840-841 Backgrinding Systems
This unit features two-spindle, three-rotary-chuck table specifications, allowing high-quality ultra-thin grinding for thin wafers 3D integration, bonded wafers, etc. With two-spindle, two-chuck table specifications, and a robot arm, the Disco 840 and 841 machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling. For safety, the DFG841 complies with the EC’s CE marking and is based on the SEMI S2-93.
Axus Technology maintains an inventory of high-quality new, used, and refurbished process equipment. Standard specifications for these systems are provided below.
Features:
- Handles wafers from 4-8″
- In-feed grinding with wafer rotation
- Two independently adjustable spindles
- Spindle speed – 1000-7000 RPM
- Vertical stroke – 110 mm
- Porous chuck table with vacuum chuck
- 8” diamond grinding wheel
- Two cassettes for loading/unloading
- Planarity accuracy within wafer – 0.0015 mm
- DFG841 complies with the EC’s CE marking
file_downloadDisco-840-Rev-02-01-14.pdf
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