DISCO DFG 840/841 Grinder

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By AXUS

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You may be interested in these products:

DISCO DFG8540 Grinder

Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design,…

Product Type:

Equipment


Application:

Grinding/Dicing


Product Description:

AXUS technology specializes in the remanufacturing of CMP, Wafer Grinding & Wafer Cleaning  Equipments as well as the supply of upgrades and spare parts.
Refurbished DFG840-841 Backgrinding Systems
This unit features two-spindle, three-rotary-chuck table specifications, allowing high-quality ultra-thin grinding for thin wafers 3D integration, bonded wafers, etc. With two-spindle, two-chuck table specifications, and a robot arm, the Disco 840 and 841 machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling. For safety, the DFG841 complies with the EC’s CE marking and is based on the SEMI S2-93.
Axus Technology maintains an inventory of high-quality new, used, and refurbished process equipment. Standard specifications for these systems are provided below.


Features:
  •     Handles wafers from 4-8″
  •     In-feed grinding with wafer rotation
  •     Two independently adjustable spindles
  •     Spindle speed – 1000-7000 RPM
  •     Vertical stroke – 110 mm
  •     Porous chuck table with vacuum chuck
  •     8” diamond grinding wheel
  •     Two cassettes for loading/unloading
  •     Planarity accuracy within wafer – 0.0015 mm
  •     DFG841 complies with the EC’s CE marking

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You might be interested in:

DISCO DFG8540 Grinder

Disco DFG8540 system is a fully automatic in-feed surface grinder. With its conventional two-spindle, three-chuck design,…


Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.