CMP POLI 762

Product Enquiry

Product Enquiry Form

By GNP

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

The POLI-762 is Our Most Advanced and Intelligent CMP designed for High Versatility for 12″(300mm) CMP Process Development, Materials Evaluation and Pre-Production Runs. The POLI-762 was also designed for Advanced Wafer Manufactures and Consumables Suppliers.


Specifications

  • Head, Table 30 ~ 200rpm, Rotational motion, Head oscillation(± 12㎜)
  • Size 1,580W 1,480D 1,960H㎜
  • Platen size Ø762㎜, (30inch), Teflon coated Aluminum
  • Pressing method Variable air pressure electronic controller
  • Membrane Type : 70 ~ 350g/㎠(1psi ~ 5psi)
  • Wafer Down Force & Conditioning Load Monitoring System
  • Process Automatic sequence, Dry- in / Wet – out

Features

  • Workpiece : Max 12 inch wafer
  • CMP Process : Si CMP, Oxide CMP(BPSG, TEOS, SC), Metal CMP(W, Cu), STI  etc

Options

  • Conditioning : Oscillating Head Type or Swing Arm Type
  • Double Head System
  • Friction Force & Temperature Monitoring System

Characteristics

  • 300mm CMP Machine for R&D
  • Stable Repeatablilty (WTWNU<5%)
  • High Rigidity
  • Wide Application for CMP R&D

file_downloadBrochure-POLI762.pdf

  • Workpiece Max 12inch wafer
  • CMP Process  Si CMP, Oxide CMP(BPSG, TEOS, ThOx), Metal CMP(W, Cu), STI, etc.


Product Enquiry Form