Product Type:
Equipment
Application:
CMP
Product Description:
The POLI-762 is Our Most Advanced and Intelligent CMP designed for High Versatility for 12″ (300 mm) CMP Process Development, Materials Evaluation, and Pre-Production Runs. The POLI-762 was also designed for Advanced Wafer Manufactures and Consumables Suppliers.
Contact S3 Alliance for a quotation for this semiconductor polishing tool.
Specifications
- Head, Table 30–200 RPM, Rotational motion, Head oscillation (± 12㎜)
- Size 1,580 (W) x 1,480 (D) x 1,960 (H) ㎜
- Platen size Ø762 ㎜ (30″), Teflon-coated Aluminum
- Pressing method: Variable air pressure electronic controller
- Membrane Type: 70–350 g/㎠(1–5 psi)
- Wafer Down Force & Conditioning Load Monitoring System
- Process Automatic sequence, Dry-in / Wet-out
Features
- Workpiece: Max 12″ wafer
- CMP Process: Si CMP, Oxide CMP (BPSG, TEOS, SC), Metal CMP (W, Cu), STI, etc.
Options
- Conditioning: Oscillating Head Type or Swing Arm Type
- Double Head System
- Friction Force & Temperature Monitoring System
Characteristics
- 300 mm CMP Machine for R&D
- Stable Repeatability (WTWNU <5%)
- High Rigidity
- Wide Application for CMP R&D
file_downloadBrochure-POLI762.pdf
- Workpiece Max 12″ wafer
- CMP Process Si CMP, Oxide CMP(BPSG, TEOS, ThOx), Metal CMP(W, Cu), STI, etc.