Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Post CMP Wafer Cleaner is Integrated with Two Double-Brush Stations with Compact Design for a Small Footprint and Versatility of Cleaning (8–12″) Wafers.
Applicable wafer size: 200 ㎜ (8”) and 300 ㎜ (12”)
Configuration:
- Stand alone with 4 cleaning stations
- Pre-cleaning with DIW knife
- Two double-sided roll brush cleaning
- Spin rinse dry with N2 blow (Option: Separated QDR)
- Cleaner size: 1,970 (W) x 975 (D) x 1,380 (H) ㎜
- Brush size: Ø70 (OD), Ø32 (ID), 320 (L) ㎜
Pre-cleaning station:
- DIW spray cleaning & DIW curtain between stations
- Roller brush station
- Chemical: NH4OH( < 1 %) or DIW
- Brush type: Double-sided PVA brush
- Rotating speed: < ±2 % of full-scale range (30–300 RPM)
- Chemical supply: 4 Nozzles and through the brush
- Available chemical: 2 Chemical[NH4OH]
- Chemical flow rate: < 1 l / min full scale
- DI flow rate: < 5 l / min full scale
Spin station
- Spin speed: Max 2,500 RPM
- DIW rinse / N2 Blow (Option: Megasonic sweep)
Control
- Process: Auto wafer loading with Automatic sequence, Wet-in/Dry-out
- Sequence control: PC & PC touch monitor, Programmable sequence, Computer Network Comparable
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Cleaning of semiconductor wafers 200 ㎜ (8”) and 300 ㎜ (12”).