Dry Processing
S3 Alliance offers advanced dry processing solutions, including dry etch, ashing, CO2 dry cleaning, and laser cleaning. Benefit from our expertise, reliability, and innovative technology for your dry processing needs.
Dry Processing & UHP
e3611 Single Wafer Plasma Ashing System
Single chamber with 2 cassette stations and single-arm robot Asher.
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Dry Processing & UHP
e3612 Single Wafer Plasma Ashing System
Two chambers with 2 cassette stations and dual-arm robot Asher.
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Dry Processing & UHP
400P-M Probe Card Cleaner
Probe Card Cleaner, a dry cleaning system for semiconductor probe cards using advanced laser technology.
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Dry Processing & UHP
C1100 CO2 Cleaning System
Efficient removal of contaminants from semiconductor wafers.
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Dry Processing & UHP
C2200 Automatic CO2 Jet Surface Cleaner
PCB, tray and glass contaminant removal featuring a cassette loading-unloading system.
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Dry Processing & UHP
C3100 Automatic CO2 Filmframe Wafer Cleaning Syste...
Automated CO2 system for efficient and precise filmframe wafer cleaning.
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Dry Processing & UHP
DANDI 3100 CO2 Wafer Cleaning System
Based on a CO2 Gas/Snow Jet, it removes fine particles, improves defectivity, and offers fast throughput
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Dry Processing & UHP
Gemini Multi-Chamber Stripper
Compact multi-chamber, high throughput stripping system.
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Deposition, Dry Processing & UHP
Oracle Cluster CVD RIE System
The smallest and most flexible full production cluster system on the market.
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Dry Processing & UHP
Minilock - Phantom RIE
The Minilock – Phantom RIE is a Reactive Ion Etch system with a vacuum loadlock. The...
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Dry Processing & UHP
Titan Loadlocked RIE with VCE
Very compact, fully automated, vacuum loadlocked plasma system for semiconductor production.
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