e3612 Single Wafer Plasma Ashing System

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e3612 Advanced Single Wafer Plasma Asher

The e3600 product line is an advanced plasma ashing/etch system from ESI with the latest photoresist removal technology offering exceptional performance at a very competitive price.

The e3612 offer reliable, high-throughput, configurable and flexible solutions. The e3600 series can handle different dimensions of substrates at the same time with no hardware changes. With a compact modular design, it can deliver high throughput with the low cost of ownership.



  • TCP 6KW RF plasma or 3KW Microwave Plasma
  • Compact Footprint, Very Low Cost of Ownership
  • Dual Arm Pick and Place Robot
  • Downstream Plasma for extremely low damage
    High throughput >100 wph
  • Dual Cassette Holders for 100mm to 200mm wafers
  • Optional SMIF Load Stations
  • Ethernet Smart Controls for subsystems
  • Cooling Stations
  • ULPA or HEPA System



  • Two Chambers
  • 2 Cassette Stations
  • Dual Arm Robot
  • Low COO


e3611 alternative with:

  • One Chamber
  • 2 Cassette Stations
  • Single Arm Robot
  • Low COO


Or visit the product page of ESI for detailed information


e3511 Plasma Asher might also be of interest to you:
Gasonics e3511 Plasma Asher – S3 Alliance (s3-alliance.com)

Options for e3600 Platforms

  • TCP 6KW RF plasma
  • Wafer Cooling Stations
  • Single or Dual Pick Robot
  • Single or Dual Cassette Holders
  • 100mm to 200mm wafers
  • Optional ULPA System
  • Wafer scanner on robot
  • Optional SMIF load system
  • Options for

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  • Bulk Resist,
  • Post LDI Resist Strip
  • Polymer Removal
  • Descum processing
  • Surface Treatment for better Dep Adhesion
  • Post high dose implant strip
  • Oxidation
  • Isotropic etch
  • MEMS

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