By ESI
Supplier Info
Product Type:
Equipment
Application:
Dry Processing
Product Description:
e3612 Advanced Single Wafer Plasma Asher
The e3600 product line is an advanced plasma ashing/etch system from ESI with the latest photoresist removal technology offering exceptional performance at a very competitive price.
The e3612 offers reliable, high-throughput, configurable, and flexible solutions. The e3600 series can handle different dimensions of substrates at the same time with no hardware changes. With a compact modular design, it can deliver high throughput with a low cost of ownership.
Features
- TCP 6 kW RF plasma or 3 kW Microwave Plasma
- Compact Footprint, Very Low Cost of Ownership
- Dual Arm Pick and Place Robot
- Downstream Plasma for extremely low damage
High throughput >100 wph - Dual Cassette Holders for 100 mm to 200 mm wafers
- Optional SMIF Load Stations
- Ethernet Smart Controls for subsystems
- Cooling Stations
- ULPA or HEPA System
e3612
- Two Chambers
- 2 Cassette Stations
- Dual Arm Robot
- Low COO
e3611 alternative with:
- One Chamber
- 2 Cassette Stations
- Single Arm Robot
- Low COO
Or visit the product page of ESI for detailed information
Options for e3600 Platforms
- TCP 6 kW RF plasma
- Wafer Cooling Stations
- Single or Dual Pick Robot
- Single or Dual Cassette Holders
- 100 mm to 200 mm wafers
- Optional ULPA System
- Wafer scanner on robot
- Optional SMIF load system
- Options for
file_downloadESI-e3600-series-flyer_e3612-and-e3611.pdf
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- Bulk Resist,
- Post LDI Resist Strip
- Polymer Removal
- Descum processing
- Surface Treatment for better Dep Adhesion
- Post high dose implant strip
- Oxidation
- Isotropic etch
- MEMS