By AXUS
Supplier Info
Product Type:
Equipment
Application:
Grinding/Dicing
Product Description:
The Strasbaugh 7AF Wafer Grinder is an advanced wafer grinding solution for semiconductor, data storage, SOI, LED, and a variety of R&D applications. The 7AF delivers high volume throughput with superior finish and thickness control. The force-sensitive mechanics and advanced control system allow adaptive grinding that is determined by grinding wheel dynamics resulting in reduced sub-surface damage and increased product yield.
Axus Technology specializes in remanufacturing CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spare parts.
Standard Features Include:
- Touch Screen Controls, 19” Intuitive Interface
- Dual grinding spindles, coarse and fine
- Force adaptive grinding technology
- Dual wafer spindles for optimal throughput
- Four input/output cassette stations
- Robotic load and unload with flipping end effector
- In-situ thickness measurement gauges
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