Product Type:
Equipment
Application:
CMP
Product Description:
The G&P Technology POLI 500 tool is used for the planarization of dielectric, conducting, and semiconductor thin films on silicon wafers and other substrate materials. This polishing tool is an excellent choice for processing 6” (150 mm) and 8” (200 mm) wafers. This tool is available in several different configurations depending upon the customer’s need for the carrier type, pad conditioning technology, pad profiling capability, and process measurement and monitoring control systems. In the tradition of all G & P Technology tools and equipment, the POLI-500 is a versatile and flexible process tool already chosen by R&D laboratories, university research centers, consumables suppliers, substrate manufacturers, and chip developers.
Contact S3 Alliance for a quotation for this semiconductor polishing tool.
- Head, Table: 30–200 RPM, Rotational motion
- Head oscillation: ± 20 mm
- Size: 1100 (W) x 1150 (D) x 1880 (H) mm
- Platen size: Φ 508 mm (20″)
- Pressing method: Variable air pressure electronic controller
- Hard Carrier Type: 80–500 g/cm 2 (1–7 psi) for 8″ wafer
- Flexible Membrane Type: 80–500 g/cm 2
- Process: Automatic sequence, Dry-in/Wet-out
Features
- Workpiece: Max 8″ wafer, MEMS Structure, Coupon Wafer
- CMP Process: Si CMP, Oxide CMP (BPSG, TEOS, SC), Metal CMP (W, Cu), STI, PGI, and more.
Options
- Conditioning: Oscillating Head Type or Swing Arm Type
- Double Head System
- Friction Force & Temperature Monitoring System
- Characteristics
- 200 mm CMP Machine for R&D
- Stable Repeatability (WTWNU< 5 %)
- High Rigidity
- Simple, Robust, and Low Cost of Ownership
- Workpiece: Max 8″ wafer, MEMS Structure, Coupon Wafer
- CMP Process : Si CMP, Oxide CMP(BPSG, TEOS, SC), Metal CMP(W, Cu), STI, PGI etc