By GNP
Supplier Info
Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Semi-Automatic Single Wafer Cleaner
The Zeus cleaning system is a high-performance wafer cleaner that sequentially performs five cleaning processes and allows for full customization. It is particularly effective for particle removal after CMP, enabling real-time, continuous application of all cleaning steps.
The system supports wafer sizes from 20mm x 20mm coupon wafers to 300mm diameter wafers, all within a single unit, eliminating the need for multiple systems. After cleaning, wafers are spin dried, allowing for immediate particle inspection. Its ability to clean coupon wafers enables quick assessment of new cleaning solutions or processes using AFM, without requiring Full Scale Particle Counters.
Key Features:
- Performs chemical spray cleaning, megasonic spray cleaning, pad buffing, PVA brush cleaning, and spin drying.
- Each module can be independently programmed, and the cleaning sequence is customizable.
- Ensures optimal cleaning performance through simultaneous application of all five techniques.
- Eliminates the need for multiple cleaning systems for different wafer sizes.
- Allows immediate cleaning performance evaluation using particle inspection equipment.
Brush Cleaning
- Down Force Control: Max 10 kgf
- Wafer RPM: Max 3000 rpm
- Brush RPM Control: Max 400 rpm
- Torque Monitoring: Motor-Drehmomentüberwachung
- Types of Cleaning Solutions: Max 3 Lösungen
Pen Brush or Pad Buffing
- Sweep Frequency: Max 30 cpm
- Wafer RPM Control: Max 3000 rpm
- Down Force: Max 5 kgf
- RPM Control: Max 200 rpm
Megasonic Cleaning
- Sweep Frequency: Max 30 cpm
- Megasonic Frequency: ~1 MHz
- Wafer RPM Control: Max 3000 rpm
Chemical Rinse Cleaning
- Sweep Frequency: Max 30 cpm
- Flow Rate Control: Max 1 liter/min
- Wafer RPM Control: Max 3000 rpm
- No. of Chemicals: 2 Chemikalien
Spin Dry
- Blowing: N2-Luftstrom / Stickstoff-Trocknung
- Wafer RPM Control: Max 3000 rpm, 5 Sek gem.
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