Product Type:
Parts & Consumables
Application:
Dicing
Product Description:
NDS can provide a broad variety of Dicing Blades:
Resin bond Blades done to:
- reduce copper burr and smear on ductile and gummy materials
- improve chipping, feedrate and blade life on hard or brittle materials
- ultra thin blade (50microns)
Electro-formed (Nickel bond) Blades propose:
- advanced electro-formed technology
- wide selecton of bond available
- exclusive development and customized technology
Metal bond Blades done to:
- wide selecton of bond available for various semiconductor packages such as BGAs
- ultr thin blades 45microns
Vitrified bond Blades done to:
- initiative conductive vitrified bond
- porosity material
- realizes high quality process on hard materials like sapphire
see attached pdf document for more technical details
file_downloadNDS-Dicing-Blades.pdf
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Resin Blades applications:
- QFNs
- Glas for CiS Modules and opticals
- Ceramics, Quartz for Optical Fibers Communication, Splitter, IR-Cut Filter
Electro-formed Blades applications:
- EMC LED
- Chip LED
- WLCSP
- Compound
- Silicon
- Magnetics, Ceramics
- Material for Ultrathin blades
Metal Blades applications:
- Sapphire
- BGAs (LGA, CSP, SiP, MCP, EMMC, micro SD cards)
- Glas for CIS Modules and Opticals
Vitrified Blades applications:
- Hard and Brittle Materials (Crystal, Sapphire, Ceramic)