Dicing Blade (Resin, Electro-formed, metal or vitrified)

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By NDS

Supplier Info

Product Type:

Parts & Consumables


Application:

Dicing


Product Description:

NDS can provide a broad variety of Dicing Blades:

 

Resin bond Blades done to:

  • Reduce copper burr and smear on ductile and gummy materials
  • Improve chipping, feed rate, and blade life on hard or brittle materials
  • Ultra-thin blade (50 µm)

 

Electro-formed (Nickel bond) Blades propose:

  • Advanced electro-formed technology
  • A wide selection of bonds available
  • Exclusive development and customized technology

 

Metal bond Blades done to:

  • A wide selection of bonds available for various semiconductor packages such as BGAs
  • Ultra-thin blades (45 µm)

 

Vitrified Bond Blades are made with:

  • Innovative conductive vitrified bond
  • Porous material
  • High-quality processing for hard materials like sapphire

 


See the attached pdf document for more technical details.

file_downloadNDS-Dicing-Blades.pdf

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Resin Blades applications:

  • QFNs
  • Glas for CiS Modules and opticals
  • Ceramics, Quartz for Optical Fibers Communication, Splitter, IR-Cut Filter

Electro-formed Blades applications:

  • EMC LED
  • Chip LED
  • WLCSP
  • Compound
  • Silicon
  • Magnetics, Ceramics
  • Material for Ultrathin blades

Metal Blades applications:

  • Sapphire
  • BGAs (LGA, CSP, SiP, MCP, EMMC, micro SD cards)
  • Glas for CIS Modules and Opticals

Vitrified Blades applications:

  • Hard and Brittle Materials (Crystal, Sapphire, Ceramic)


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