By FEMTO SCIENCE Inc.
Supplier Info
Product Type:
Equipment
Application:
Dry Processing & UHP
Product Description:
| Dual-Power Plasma Source: | RIE (600 W) combined with a high-performance ICP source (up to 1000 W) for independent control of ion density and ion energy. |
| Integrated Load-Lock System: | Manual wafer loading with an automated single-axis transfer robot for enhanced process stability and reduced handling time. |
| Anisotropic Etch Design: | Vertical chamber configuration, specifically optimized for ion-dominated etching and ultra-steep sidewall profiles. |
| Efficient Substrate Cooling: | Helium backside cooling with mechanical clamping ensures precise temperature control during the etching process. |
| Corrosion-Resistant Monoblock Chamber: | Solid aluminum construction without weld seams, specially treated for processes involving aggressive gases. |
| Comprehensive Vacuum Instrumentation: | Combined pressure measurement using ionization, convection, and Baratron gauges for continuous monitoring. |
| High-Precision Gas Delivery: | Patented three-stage showerhead design with capacity for up to 12 MFC gas lines featuring 1/4″ VCR fittings. |
| State-of-the-Art Industrial Control: | High-performance computing system with EtherCAT I/O modules for maximum reliability and real-time monitoring. |
| Smart User Interface: | Fully automated operation, graphical process analysis, and remote access for maintenance and control. |
| Recipe Management: | AI-Assisted |
High-vacuum ICP-RIE
| Etch Mode | High-vacuum ICP-RIE (Inductively Coupled Plasma) |
| Chamber Design | Vertical-type, monoblock aluminum construction (non-welded), corrosion-resistant coating |
| Process Gas Distribution | Patented three-stage gas showerhead system for uniform distribution |
| Load-Lock Module | Manual wafer loading with automated single-axis transfer robot |
| ICP Source | 13,56 MHz, Power up to 1000 W |
| Bias Power Supply | 13,56 MHz / 12,56 MHz, Power up to 600 W |
| Substrate Handling | Ceramic-guided chuck with mechanical clamping and helium backside cooling |
| Gas Management | Up to 12 MFC gas lines, compatible with chlorine-based gases, equipped with 1/4″ VCR fittings |
| Vacuum System | Combined sensor setup (ionization, convection, and Baratron gauges) including adapted pressure control |
| Control System | Industrial PC with EtherCAT I/O, remote access, and multi-level password protection |
| System Dimensions | 1800 x 800 x 1750 mm (B x T x H) |
file_downloadfemto-science-vita-series.pdf
- Compound Semiconductor
- Failure Analysis
- Research & Development
- Pilot Line