By ONTO INNOVATION (DACH, Benelux, North France)
Supplier Info
Product Type:
Metrology & Handling
Application:
Optical Surface Inspection
Product Description:
The PrimaScan™ series of wafer and panel-level tools provides comprehensive all-surface contamination and defect inspection for opaque, transparent, and semi-transparent wafers, reticles, and panel-level substrates.
Designed to meet the R&D and high-volume production needs, the PrimaScan™ series delivers high throughput and sensitivity while ensuring the lowest cost of ownership per pass. Its advanced imaging capabilities enable precise defect detection, making it a reliable solution for semiconductor and microelectronics manufacturing.
PrimaScan™ System
The PrimaScan™ system utilizes a laser-based scanning and imaging technique, integrating proprietary optics and sensing technologies for highly reliable inspection of nanometer-sized defects on a wide range of opaque, transparent, and semi-transparent substrates. Designed for both R&D and high-volume manufacturing, it employs multi-channel inspection technologies to detect, measure, and image surface particles, scratches, pits, contamination, stains, film or bulk wafer stress, voids, and inclusions—including edge chips and cracks.
Designed with versatility in mind, the PrimaScan™ product line can accommodate various wafer sizes and substrate types, including film frame, photomask, and sample tray. This flexibility makes it ideal for both incoming wafer quality control and inline process monitoring. Its ability to handle diverse substrate materials ensures precise monitoring and control in silicon carbide (SiC) device production, glass-based microfluidics, and AR/VR/MR applications on various transparent and semi-transparent materials.
- Fully automated open cassette for 100–300 mm substrates
- Manual load for 100–450 mm substrates
- Wafer Sizes: 100–450 mm
- Four detection channels: polarization, slope, bright field, and dark field
- All-surface scan (frontside/backside/edge) and imaging with sub-nanometer sensitivity
- Particle defect (≥ 90 nm PSL) / surface contamination (≥ 5 Å)
- Simultaneous frontside / backside inspection (transparent & semi-transparent substrates ONLY)
- Thin (≥ 100 µm) and thick (≤ 7 mm) wafer/substrate handling
- Multiple handling options: wafer, photomask, film frame, JDEC tray, waffle pack
- Multiple load options: manual, automated open cassette, EFEM
- Automated Image-Based Defect Classification
- Online and offline review capability
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