Post CMP Scrubber 412RL

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By GNP

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (4″~12″) Wafers.


  • Applicable wafer size : 100㎜(4”) ~ 300㎜(12”)
  • Configuration : Input spray cleaning, Two double side brush cleaning and spin rinse dry(Option : Separated QDR)
  • Cleaner size : 1,610W 1,260D 1,640H㎜
  • Brush size : Ø70(OD) Ø31(ID) 170(L)㎜
  • Pre cleaning station : DIW spray cleaning & DIW curtain between stations

Roller brush station

  • Chemical : NH4OH or DIW
  • Brush type : PVA brush, Front and backside of wafer cleaned at the same time
  • Brush position adjustment : Manually controlled(Available brush gap range : -10㎜ ~ 2㎜)
  • Rotating speed : <±5% of full scale Range 30 ~ 200rpm
  • Chemical supply : 4 Nozzle and through the brush
  • Available chemical : 2 Chemical[NH4OH]
  • Chemical & DI flow rate : <±5% of full scale

Spin station

  • Option : Megasonic sweep
  • Spin speed : Max 2,500rpm
  • DI rinse / N2 Blow

Control

  • Process : Manual Loading with Automatic sequence, Wet-in / Dry-out
  • LCD monitor touch panel, Sequence Control PLC Type

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Cleaning of semiconductor wafers  100㎜(4”) ~ 300㎜(12”)


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