Post CMP Scrubber 326L

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By GNP

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (4″~12″) Wafers.


Applicable wafer size : 750㎜(3”) ~ 150㎜(6”)

Configuration:

  • Stand alone with 6 cleaning station
  • Wafer cassette auto loading and un-loading
  • Pre-cleaning with DIW spray
  • Two double side roll brush cleaning
  • Spin rinse dry with N2 blow
  • Cleaner size : 2,480W 1,085D 1,360H㎜
  • Brush size : Ø18(ID) 310(L)㎜
  • Pre cleaning station : DIW spray cleaning & DIW curtain between stations

Roller brush station

  • Chemical : 2 Chemical pump(1 per brush chamber), NH4OH(< 0.1wt%) or DIW
  • Brush type : Double side PVA brush
  • Brush position adjustment : Manually controlled(Available brush gap range : -1.5㎜ ~ 2㎜)
  • Rotating speed : <±2% of full scale Range 30 ~ 300rpm
  • Chemical flo w rate : < 1L/min full scale
  • DI flow rate : < 5L/min full scale

Spin station

  • Spin speed : Max 2,500rpm
  • DIW rinse / N2 Blow / Megasonic sweep

Control

  • Process : Auto wafer loading with Automatic sequence, Wet-in/Dry-out
  • Sequence control : PC & PC touch monitor, Programmable sequence, Computer Network Comparable

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Cleaning of semiconductro wafers  750㎜(3”) ~ 150㎜(6”)


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