By AXUS
Supplier Info
Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
AXUS technology specializes in the remanufacturing of CMP, Wafer Grinding, and Wafer Cleaning Equipment, as well as the supply of upgrades and spare parts. OnTrak DSS-200 Series 2 Post CMP Cleaner. OnTrak DSS 200 Series 2 Double-sided PVA Scrubber offers production-proven cleaning results for particles as small as 0.125 µm. Depending on the application, throughputs of 45–65 wafers per hour are attainable, making the DSS-200 Series 2 the most cost-effective wafer cleaning system for wafers from 150 mm to 200 mm.
Standard Features Include:
- DSS200 Series2 web
- 200 mm ergonomic load station
- Double-sided PVA scrub
- Dual brush boxes
- Ammonia dispense
- IR-assisted spin dry station
- Robotic unload
- Vertical unload station
- Touchscreen controls
Optional Features:
- Megasonics at the spin-dry-station
- Multiple chemical delivery system
- Signal light tower
file_downloadOnTrak_DSS200_Series_2_Rev_02_06_10.pdf
The DSS-200 Series 2 is a proven, cost-effective cleaning system for the following applications.
- Post-Chemical-Mechanical Polishing (CMP) Cleaning: Oxide, Polysilicon, Nitride, Tungsten, Aluminum, and Copper
- General purpose cleaning: post-CVD oxides, post-metallization, surface topography cleaning, trench cleaning
- Silicon cleaning: prime silicon; reclaim silicon, fab monitor reclaim