Product Type:
Equipment
Application:
(De-)Tapen • Mounting • Aushärten
Product Description:
EXR2 Vollautomatischer 300mm Tape Remover
Wafer-Level CSP-Fertigung und spezielles MEMS-Herstellungsverfahren
There are currently no specification available.
There are currently no downloads available.
- Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.