- S3 Alliance EXM-800CS 200mm Wafer Mounter

Supplier Info

EXM-1200X Fully Automatic Wafer Tape Mounter

Wafer tape mounting for 300 mm/12″ wafers (optionally available: 200 mm/8″ wafers) Parameters for attaching a…

Laser Cutting with heating roller and table and Digitally adjustable high-pressure performance. Removes tape from wafers…

Product Type:

Equipment

Application:

(De-)Taping • Mounting • Curing

Product Description:

Wafer Size: Up to 8″ (specify wafer type before issuing the PO)
Load Capacity One (1) TTS Original Cassette Station
Unload Capacity: One (1) Unload Magazine Station
Cassette: SEMI Standard Open Cassette (Use Even slot only if using Bernoulli finger: or DSC
Frame Magazine: SEMI 25 Slots SEMI Standard 6” Frame Cassette: or SEMI 25 Slots SEMI Standard 8” Frame Cassette
Dicing Frame Type: DISCO Standard DF2-8 or Equivalent Frame Vender (specify wafer type before issuing the PO)
UPH: 15 – 20 WPH (UPH depends on recipe setting)
Mounting Tape: Normal Roll shape tape (UV & non-UV tapes) or Pre-Cut Type tape (option)
Remove Tape: Heat Seal tape Removal Function for BG Tape removal
CCD none contact alignment: CCD sensor and Bernoulli Finger type alignment for thin wafer
Long-life Roller Blade: A newly designed Roller Cutting Blade lasts up to 100,000 times. (Applicable for normal roll tape)
Heater Capability: Max 60 degree C±3 degree C @ Mount Heat Roller: Max 60 degree C±3 degree C @ Wafer stage with Soft Si Table: Room Temp (Roller Cutter)
Big LCD Touch Screen: Big color screen for user-friendly and easy operations.
System Recipe capacity: 100 (max)
Advanced Maintenance Design: Minimum-lubrication, Easy maintenance designs.

Removing Module for BG Tape: Heat Seal tape Removal Function for BG Tape removal: Maximum applicable tape width: 75 mm
Soft Si Rubber Mount Table: Applicable Soft Silicone rubber Universal Table (With Full ESD controlled contacts) Soft Silicone rubber table achieves highly secured wafer holding during Dicing Tape Lamination
Remove Table: Applicable Ceramic Universal Table for BG Tape Remove

Ceramic Remove Table

Soft SI Mount Table

Frame Stock Station: Frame Stock station equipped with frame Stock Detection and double frame detection
Applicable Mounting Tape Width: 8” Frame > 295 mm (min) 330 mm (max)

Thin Wafer Capability: Micro Bernoulli Finger can handle Thin wafer
Wafer Mapping Capability: Applicable Intellige nt Wafer Mapping at Loading Station
In-Line LED UV Irradiator: Intelligent LED UV irradiation methods UV Lamp Life Guaranteed 1 5,000 hours)
SECS/GEM: Applicable TTS Standard SECS/GEM capability following SEMI Stand
Frame Barco de Print & Reader: Applicable Integrated Frame barcode reader by Keyence, Printer by SATO.
Wafer ID OCR: High-performance OCR Vision Engine by (Option must place PO together with equipment).

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