By MILLICE
Supplier Info
Product Type:
Equipment
Application:
Equipment Others
Product Description:
The DXB 880 Wafer Bonder is a compact, fully automated tabletop wafer bonder built for void free bonding. Small enough to fit on most lab benches, it features simple setup, intuitive controls, and fast cycle times – making it ideal for labs that need reliable, repeatable bonding without bulky equipment.
Key Features:
- Tabletop design fits easily in most labs
- Programmable temperature, pressure, and time for each step
- Real-time display of bonding status
- Recipes can be saved and password protected
- Quick setup and user-friendly interface
- Dual chamber vacuum system ensures void-free bonding
- Active cooling cools from 180°C to 40°C in 6–10 minutes
- Handles wafers up to 11.25″ in diameter
- Available in 120 VAC and 240 VAC single-phase options
| DXB 880 Series: | DXB-880-01 | DXB-880-02 |
| Bonding Chamber Size: | 11″ (279 mm) Diameter | 11″ (279 mm) Diameter |
| Temperature Range: | 100 – 356° F (40 – 180° C) | 100 – 356° F (40 – 180° C) |
| Cycle Time Range: | 1 min – 10 hrs | 1 min – 10 hrs |
| Power Required: | 100/120 VAC 10 amps, 50/60 Hz | 220/240 VAC 5 amps, 50/60 Hz |
| Vacuum Required: | 18 – 25 inHg | 18 – 25 inHg |
| Coolant: | Water (12 liters per minute, 40 psi) | Water (12 liters per minute, 40 psi) |
| Environmental: | 60 – 80° F (15 – 27° C); 0 – 95% Humidity (non-condensing) |
60 – 80° F (15 – 27° C); 0 – 95% Humidity (non-condensing) |
| Dimensions: | Height: 26″ (200 mm); Width: 14.7″ (375 mm); Depth: 21.2″ (440 mm); Chuck: 11.25″ (285 mm) |
Height: 26″ (200 mm); Width: 14.7″ (375 mm); Depth: 21.2″ (440 mm); Chuck: 11.25″ (285 mm) |
file_downloadmillice-dxb-880-flyer-v6-030425.pdf
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- Wafer Thinning
- Wafer Lapping
- Metal Plating
- Wafer Polishing
- Wafer Dicing
- Deep Reaction Ion Etch
- Any other temporary wafer bonding process