Disco DAG810 Grinder

AXUS technology specializes in the remanufacturing of CMP, Wafer Grinding & Wafer Cleaning  Equipments as well as the supply of upgrades and spare parts.

The DAG810 is a compact, automatic grinder for workpieces up to 8” in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. The newly developed high-rigidity, low-vibration spindle achieves superior grinding results and is capable of in-feed grinding and creep-feed grinding (option). The DAG810 is designed to handle unlimited materials to process hard or brittle substrates of various diameters with ease.