By AXUS
Supplier InfoProduct Type:
Equipment
Application:
Grinding/Dicing
Product Description:
AXUS technology specializes in the remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spare parts.
The DAG810 is a compact, automatic grinder for workpieces up to 8” in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. The newly developed high-rigidity, low-vibration spindle achieves superior grinding results and is capable of in-feed grinding and creep-feed grinding (option). The DAG810 is designed to handle unlimited materials to process hard or brittle substrates of various diameters with ease.
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