CMP POLI 610

Product Enquiry

Product Enquiry Form

By GNP

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

The POLI-610 is Our Most Advanced and Intelligent CMP designed for High Versatility for 12″(300mm) CMP Process Development, Materials Evaluation and Pre-Production Runs. The POLI-610 was also designed for Advanced Wafer Manufactures and Consumables Suppliers. Contact S3 Alliance for a quotation for this semiconductor polishing tool


Specifications

  • Head, Table 30 ~ 200rpm, Rotational motion, Head oscillation(± 12㎜)
  • Size 1,200W 1,290D 1,960H㎜
  • Platen size Ø623㎜(25inch), Anodized Aluminum(Option : Teflon Coated)
  • Pressing method Variable air pressure electronic controller
  • Carrier Type : 350kgf
  • Wafer Down Force & Conditioning Load Monitoring System
  • Process Automatic sequence, Dry- in / Wet-out

Features

  • Workpiece : Max 8 ea of 3inch wafers/run, Max 6 ea of 4inch wafers/run
  • CMP Process : CMP for compound wafers including SiC, GaN and sapphire, etc.

Options

  • Pad Conditioning Method : Oscillation Head Type
  • Double Head System : Oscillation Head Type
  • Friction Force & Temperature Monitoring System

Characteristics

  • Stable repeatability(WTWNU < 5%)
  • High Rigidity

file_downloadBrochure-POLI610.pdf

There are currently no videos available.

  • Workpiece Max 8 ea of 3inch wafers/run, Max 6 ea of 4inch wafers/run
  • CMP Process  CMP for compound wafers including SiC, GaN and sapphire, etc.


Product Enquiry Form