Product Type:
Equipment
Application:
Deposition
Product Description:
Atomic Basic
Compact reactor Thermal ALD
- Compact ALD Model
- Thermal ALD
- Wafer Size: ≤ 6″ Wafer
- Process temperature: up to 250°C
- Applications: Oxide Film (Al₂O₃), etc
- Very small volume for process
There are currently no specification available.
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