Product Type:
Equipment
Application:
ALD
Product Description:
Einfaches und kompaktes System
- Thermisches ALD-Tool
- Kompakte Bauweise
- Wafergröße: ≤ 6 „Wafer
- Prozesstemperatur: bis zu 250 ° C.
- Anwendungen: Oxidfilm (Al₂O₃) usw.
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- Semiconductor (DRAM, System LSI, etc)
- Display (AMOLED, Micro-OLED, etc)
- Photovoltaic (Si base PV & CIGS)
- MEMS, Sensor, Battery, etc