4 sites FOUP AMR

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By GYRO

Supplier Info

Product Type:

Metrology & Handling


Application:

Automation


Product Description:

AMR for 12″ FOUP

The FOUP AMR (Autonomous Mobile Robot) is a highly advanced automation solution designed for safe, efficient, and reliable material transport in semiconductor manufacturing environments. With a capacity of up to 4 FOUPs, it is optimized for handling 12″ FOUP / FOSB carrier types, making it ideally suited for wafer manufacturing, foundries, wafer bumping, and wafer probing applications. It enables a stable and continuous material flow, supporting maximum equipment utilization in high-volume 300 mm fabs.

Combining precision navigation with advanced handling capabilities and full industry-standard integration, the system ensures consistent performance even in the most complex production layouts. Its architecture is designed for maximum safety, flexibility, and process reliability in fully automated factory environments.

Capacity: 4 FOUPs
Applications: Wafer Manufacturer, Foundry, Wafer Bumping, Wafer Probing

 

Features:

  • No blind spots in navigation positioning / safety detection
  • Secondary body positioning – Omnidirectional wheels/visual precise alignment
  • Robotic arm 2.5D vision – 6 degrees of freedom coordinate calibration
  • 6-axis Collaborative Robot with ISO 10218-1 & 15066 Certification
  • SEMI-S2, -S8, -S10, -S13, -S14, -S17 & -S22 Certification
  • Support LF RFID / UHF RFID / BARCODE READER
  • Support E84 SEMI standard
  • Support SEMI SECS/GEM (GEM300 REPORT)


There are currently no specifications available.

  • Wafer Manufacturer
  • Foundry
  • Wafer Bumping
  • Wafer Probing


Product Enquiry Form

  • This field is for validation purposes and should be left unchanged.