By GNP
Supplier Info
Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Post CMP Wafer Cleaner is Integrated with Two Double-Brush Stations with Compact Design for a Small Footprint and Versatility of Cleaning (4–12″) Wafers.
- Applicable wafer size: 100 mm (4″) and 300 mm (12″)
- Configuration: Spray cleaning, one double-sided brush cleaning, and spin rinse dry (Option: Separated QDR)
- Cleaner size: 1,100 (W) x 1,100 (D) x 1,650 (H) mm
- Brush size: Ø 70 mm (OD), Ø 32 mm (ID), 170 mm (L)
- Brush gap adjustment: Automatically PLC controlled (Available brush gap range: -10–2 mm)
- Chemical: NH4OH ~ 1% available
- Brush type: Double-Sided PVA Brush
- Brush rotating speed: Max 400 RPM
- Spin speed: Manual Loading with Automatic sequence, Wet-in / Dry-out Max 2,000 RPM
- DIW rinse / N2 Blow
- Process: Manual Loading with Automatic sequence, Wet-in / Dry-out
- LCD monitor touch panel, Sequence Control PLC Type
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Cleaning of semiconductor wafers : 100 mm (4″) and 300 mm (12″)