Post CMP Scrubber 412S

Product Enquiry

Product Enquiry Form

By Bsp

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

Post CMP Wafer Cleaner is Integrated with Two Double Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (4″~12″) Wafers.


  • Applicable wafer size : 200㎜(8”) and 300㎜(12”)
  • Configuration : Spray cleaning, One double side brush cleaning and spin rinse dry(Option : Separated QDR)
  • Cleaner size : 1,000W 835D 1,250H㎜
  • Brush size : Ø70(OD) Ø32(ID) 170(L)㎜
  • Brush gap adjustment : Automatically PLC controlled(Available brush gap range : -10㎜ ~ 2㎜)
  • Chemical : NH4OH ~ 1% available
  • Brush type : Max 200rpm
  • Brush rotating speed : Max 2,000rpm
  • Spin speed : Manual Loading with Automatic sequence, Wet-in / Dry-outMax 2,000rpm
  • DI rinse / N2 Blow
  • Process : Manual Loading with Automatic sequence, Wet-in / Dry-out
  • LCD monitor touch panel, Sequence Control PLC Type

There are currently no downloads available.

Cleaning of semiconductor wafers : 200㎜(8”) and 300㎜(12”)


Product Enquiry Form