Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
Post CMP Wafer Cleaner is Integrated with Two Double-Brush Stations with Compact Design for Small Footprint and Versatility of Cleaning (4–12″) Wafers.
Contact our team for more information on this post-polishing cleaner.
- Applicable wafer size: 100 ㎜ (4″) to 300 ㎜ (12″)
- Configuration: Input spray cleaning, two double-sided brush cleaning, and spin rinse dry (Option: Separated QDR)
- Cleaner size: 1,610 (W) x 1,260 (D) x 1,640 (H) ㎜
- Brush size: Ø70(OD) Ø31(ID) 170(L) ㎜
- Pre-cleaning station: DIW spray cleaning & DIW curtain between stations
Roller brush station
- Chemical: NH4OH or DIW
- Brush type: PVA brush, Front and backside of wafer cleaned at the same time
- Brush position adjustment: Manually controlled (Available brush gap range: -10–2 ㎜)
- Rotating speed: < ± 5% of full-scale range (30–200 RPM)
- Chemical supply: 4 Nozzles and through the brush
- Available chemical: 2 Chemical[NH4OH]
- Chemical & DI flow rate: < ±5 % of full-scale
Spin station
- Option: Megasonic sweep
- Spin speed: Max 2,500 RPM
- DI rinse / N2 Blow
Control
- Process: Post-polishing cleaner has manual loading with automatic sequence, Wet-in / Dry-out
- LCD monitor touch panel, Sequence Control PLC Type
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Cleaning of semiconductor wafers 100 ㎜ (4”) to 300 ㎜ (12”).