By GNP
Supplier Info
Product Type:
Equipment
Application:
CMP, Wet Processing
Product Description:
The post-CMP wafer Cleaner is Integrated with two double-brush stations, each with a Compact Design for a Small Footprint and Versatility in Cleaning (3–6″) Wafers.
Applicable wafer size: 75 ㎜ (3″) – 150 ㎜ (6″)
Configuration:
- Stand alone with 6 cleaning stations
- Wafer cassette auto-loading and unloading
- Pre-cleaning with DIW spray
- Two double-sided roll brush cleaning
- Spin rinse dry with N2 blow
- Cleaner size: 2,480 (W) x 1,085 (D) x 1,360 (H) ㎜
- Brush size: Ø18 (ID) 310 (L) ㎜
- Pre-cleaning station: DIW spray cleaning & DIW curtain between stations
Roller brush station
- Chemical: 2 Chemical pumps (1 per brush chamber), NH4OH(< 0.1 wt%) or DIW
- Brush type: Double-sided PVA brush
- Brush position adjustment: Manually controlled (Available brush gap range: -1.5–2 ㎜)
- Rotating speed: <± 2% of full scale Range 30–300 RPM
- Chemical flow rate: < 1 l/min full scale
- DI flow rate: < 5l/min full scale
Spin station
- Spin speed: Max 2,500 RPM
- DIW rinse / N2 Blow / Megasonic sweep
Control
- Process: Auto wafer loading with Automatic sequence, Wet-in/Dry-out
- Sequence control: PC & PC touch monitor, Programmable sequence, Computer Network Comparable
There are currently no downloads available.
Cleaning of semiconductor wafers 75 ㎜ (3”) – 150 ㎜ (6”)