By GNP
Supplier Info
Product Type:
Equipment
Application:
CMP
Product Description:
The POLI-610 is Our Most Advanced and Intelligent CMP designed for High Versatility for 12″ (300 mm) CMP Process Development, Materials Evaluation, and Pre-Production Runs. The POLI-610 was also designed for Advanced Wafer Manufactures and Consumables Suppliers.
Contact S3 Alliance for a quotation for this semiconductor polishing tool.
Specifications
- Head, Table 30–200 RPM, Rotational motion, Head oscillation(± 12㎜)
- Size 1,200 (W) x 1,290 (D) x 1,960 (H) ㎜
- Platen size Ø 623 ㎜ (25″), Anodized Aluminum (Option: Teflon Coated)
- Pressing method: Variable air pressure electronic controller
- Carrier Type: 350 kgf
- Wafer Down Force & Conditioning Load Monitoring System
- Process Automatic sequence, Dry-in / Wet-out
Features
- Workpiece: Max 8 ea of 3″ wafers/run, Max 6 ea of 4″ wafers/run
- CMP process: CMP for compound wafers, including SiC, GaN, sapphire, and more.
Options
- Pad Conditioning Method: Oscillation Head Type
- Double Head System: Oscillation Head Type
- Friction Force & Temperature Monitoring System
Characteristics
- Stable Repeatability (WTWNU <5%)
- High Rigidity
file_downloadBrochure-POLI610.pdf
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- Workpiece Max 8 ea of 3″ wafers/run, Max 6 ea of 4″ wafers/run
- CMP Process CMP for compound wafers including SiC, GaN, sapphire, etc.