StripAid™ X Solvent

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Supplier Info


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Product Type:

Parts & Consumables


Application:

Chemicals & Photoresists


Product Description:

StripAid™ X Solvent is a biodegradable hydrocarbon used for debonding the temporary adhesive WaferGrip. The non-hazardous formulation makes StripAid™ X Solvent a popular choice for processes in which environmental impact is a particular concern. StripAid™ X Solvent can be used at ambient or elevated temperature and with ultrasonic agitation.

Perfect matched to WaferGrip™ Adhesives.


Specific Gravity @ 68°F: 0.97
Density @ 68°F (lbs/gallon): 8.1
Solubility in Water: Negligible
Water Solubility in Strip Aid @25°C (% by weight): 0.2
Absolute Viscosity 68°F (cSt): 55
Flash Point (°C): 212
Vapor Pressure: Negligible
Color: Cloudy
Odor: Mild
Other: Contains no animal by-products

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StripAid X Solvent is specially formulated to remove WaferGrip Adhesives. The recommended process steps are:

  1. Soak in StripAid at 110° C for 5 to 20 minutes
  2. Soak in clean StripAid at 110° C for 5 to 20 minutes
  3. Acetone rinse
  4. IPA rinse
  5. DI water rinse



You might be interested in:

DXB 880 Wafer Bonder

The DXB 880 Wafer Bonder is a compact, fully automated tabletop wafer bonder built for void…

WaferGrip™ Adhesives

WaferGrip™ Adhesives are advanced composite film adhesives engineered to bond wafers, thin film heads, optics, and…


Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.